Manian Ramkumar
Manian Ramkumar
2014 Submissions
Published Conference Proceedings
Ramkumar, S. Manian and Andrew Daya. "Effect of Thermal Shock on Lead Free Alloy Combinations in Package on Package Assemblies." Proceedings of the Surface Mount Technology Association International. Ed. SMTA. Chicago, IL: SMTA, 2014. Print.
2013 Submissions
Published Conference Proceedings
Ramkumar, S. Manian, et al. "Effect of BGA Re-Balling and its Influence on Ball Shear Strength." Proceedings of the IPC APEX Conference. Ed. IPC. San Diego, CA: n.p., 2013. Print.
Ramkumar, S. Manian and Andrew Daya. "Effect of Mixed Alloy BGA Reballing on Board Level Drop Test Reliability." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Fort Worth, TX: n.p., 2013. Print.
External Scholarly Fellowships/National Review Committee
3/26/2013 -
8/31/2015
Department of Labor/UoR
Amount: $159,748
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9/23/2013 -
11/22/2013
NASA/Jet Propulsion Laboratory
Amount: $9,493
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2012 Submissions
Published Conference Proceedings
Ramkumar, S. Manian, Mathew Combs, and Satish Kandlikar. "Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead Free Electronics Packaging." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web. *
Ramkumar, Dr. S. Manian, et al. "Evaluation of a Novel Anisotropic Conductive Adhesive Shear under Multiple Tin-Lead and Lead-free Reflow Cycles for Package-on-Package (PoP) Assembly." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web. *
Ramkumar, Dr. S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. SMTA. Orlando, FL: SMTA, 2012. Web. £
Ramkumar, S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Orlando, FL: n.p., 2012. Print.
Journal Editor
Ramkumar, Dr. S. Manian, ed. Transactions on Component, Packaging and Manufacturing Technology. Washington DC: IEEE, 2012. Web. *
External Scholarly Fellowships/National Review Committee
9/3/2012 -
8/29/2014
NYS - DEC
Amount: $308,132
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9/1/2012 -
3/30/2013
NYS - DOL
Amount: $49,524
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9/1/2012 -
3/30/2013
NYS - DOL
Amount: $42,650
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10/1/2012 -
12/31/2012
Alstom Transport
Amount: $15,000
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2011 Submissions
Invited Keynote/Presentation
Ramkumar, S. Manian. "Successful Practices for Online Computing, Engineering, and Technology Courses." 41st ASEE/IEEE Frontiers in Education. ASEE/IEEE. Rushmore Plaza Civic Center, Rapid City, SD. 12-15 Oct. 2011. Conference Presentation.
Ramkumar, S. Manian. "Novel Anisotropic Conductive Adhesive for 3D Stacking and Lead-free PCB Packaging A Review." 61st Electronic Components and Technology Conference. IEEE. Walt Disney World, Lake Buena Vista, FL. 31 May 2011. Conference Presentation.
Ramkumar, S. Manian. "Effect of Stencil Technology on Ultra Fine Pitch Printing." SMTA International Conference Proceedings. SMTA. Fort Worth Convention Center, Fort Worth, TX. 16-20 Oct. 2011. Conference Presentation.
Ramkumar, S. Manian. "Effect of Nano-Coated Stencil on 01005 Printing." IPC APEX. IPC. Mandalay Bay Convention Center, Las Vegas, NV. 12-14 Apr. 2011. Conference Presentation.
Ramkumar, S. Manian. "Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive under Temperature/Humidity Aging." Pan Pacific Microelectronics Symposium. SMTA. Hapuna Prince Hotel, Big Island, HI. 18-20 Jan. 2011. Conference Presentation.
External Scholarly Fellowships/National Review Committee
7/1/2011 -
12/31/2011
NASA - Jet Propulsion Laboratory
Amount: $7,400
6/1/2011 -
6/30/2011
General Motors
Amount: $6,000
7/1/2011 -
8/31/2011
KIC
Amount: $9,200
3/1/2011 -
3/15/2011
Vicor Corporation
Amount: $5,000
6/1/2011 -
6/30/2011
Carestream Health
Amount: $5,000
8/1/2011 -
8/31/2011
Celestica
Amount: $25,000
2010 Submissions
Published Article
Dhanasekaran, Rangaraj, Harish Gadepalli, and S. Manian Ramkumar. “Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly.” SMTA International Conference Proceedings, 25-28 Oct. 2010. n.p. Print. " É *
Editor (book or journal)
Ramkumar, S. Manian. “Packaging and Assembly of Microlectronic Devices and Systems.” Nanotechnology For Telecommunications. ed. Sohail Anwar. Boca Raton: CRC Press, 2010. 335-371. Print.