S. Manian Ramkumar Headshot

S. Manian Ramkumar

Dean, College of Engineering Technology

Dean’s Office
College of Engineering Technology
ramkumar@mail.rit.edu
585-475-6081
Office Location
ROS-1116
Office Mailing Address
Building 78, Room 1518 29 Lomb Memorial Drive Rochester NY

S. Manian Ramkumar

Dean, College of Engineering Technology

Dean’s Office
College of Engineering Technology

Education

BE, PSG, College of Technology-Bharathiar (India); ME, Rochester Institute of Technology; Ph.D., State University of New York at Binghamton

ramkumar@mail.rit.edu
585-475-6081

Select Scholarship

Published Conference Proceedings
Ramkumar, S. Manian and Andrew Daya. "Effect of Thermal Shock on Lead Free Alloy Combinations in Package on Package Assemblies." Proceedings of the Surface Mount Technology Association International. Ed. SMTA. Chicago, IL: SMTA, 2014. Print.
Ramkumar, S. Manian, et al. "Effect of BGA Re-Balling and its Influence on Ball Shear Strength." Proceedings of the IPC APEX Conference. Ed. IPC. San Diego, CA: n.p., 2013. Print.
Ramkumar, S. Manian and Andrew Daya. "Effect of Mixed Alloy BGA Reballing on Board Level Drop Test Reliability." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Fort Worth, TX: n.p., 2013. Print.
Ramkumar, S. Manian, Mathew Combs, and Satish Kandlikar. "Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead Free Electronics Packaging." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web.
Ramkumar, Dr. S. Manian, et al. "Evaluation of a Novel Anisotropic Conductive Adhesive Shear under Multiple Tin-Lead and Lead-free Reflow Cycles for Package-on-Package (PoP) Assembly." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web.
Ramkumar, Dr. S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. SMTA. Orlando, FL: SMTA, 2012. Web.
Ramkumar, S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Orlando, FL: n.p., 2012. Print.
External Scholarly Fellowships/National Review Committee
3/26/2013 - 8/31/2015
     Department of Labor/UoR
     Amount: $159,748
9/23/2013 - 11/22/2013
     NASA/Jet Propulsion Laboratory
     Amount: $9,493
9/3/2012 - 8/29/2014
     NYS - DEC
     Amount: $308,132
9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $49,524
9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $42,650
10/1/2012 - 12/31/2012
     Alstom Transport
     Amount: $15,000
7/1/2011 - 12/31/2011
     NASA - Jet Propulsion Laboratory
     Amount: $7,400
6/1/2011 - 6/30/2011
     General Motors
     Amount: $6,000
7/1/2011 - 8/31/2011
     KIC
     Amount: $9,200
3/1/2011 - 3/15/2011
     Vicor Corporation
     Amount: $5,000
6/1/2011 - 6/30/2011
     Carestream Health
     Amount: $5,000
8/1/2011 - 8/31/2011
     Celestica
     Amount: $25,000
Journal Editor
Ramkumar, Dr. S. Manian, ed. Transactions on Component, Packaging and Manufacturing Technology. Washington DC: IEEE, 2012. Web.
Invited Keynote/Presentation
Ramkumar, S. Manian. "Successful Practices for Online Computing, Engineering, and Technology Courses." 41st ASEE/IEEE Frontiers in Education. ASEE/IEEE. Rushmore Plaza Civic Center, Rapid City, SD. 12-15 Oct. 2011. Conference Presentation.
Ramkumar, S. Manian. "Novel Anisotropic Conductive Adhesive for 3D Stacking and Lead-free PCB Packaging A Review." 61st Electronic Components and Technology Conference. IEEE. Walt Disney World, Lake Buena Vista, FL. 31 May 2011. Conference Presentation.
Ramkumar, S. Manian. "Effect of Stencil Technology on Ultra Fine Pitch Printing." SMTA International Conference Proceedings. SMTA. Fort Worth Convention Center, Fort Worth, TX. 16-20 Oct. 2011. Conference Presentation.
Ramkumar, S. Manian. "Effect of Nano-Coated Stencil on 01005 Printing." IPC APEX. IPC. Mandalay Bay Convention Center, Las Vegas, NV. 12-14 Apr. 2011. Conference Presentation.
Ramkumar, S. Manian. "Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive under Temperature/Humidity Aging." Pan Pacific Microelectronics Symposium. SMTA. Hapuna Prince Hotel, Big Island, HI. 18-20 Jan. 2011. Conference Presentation.
Editor (book or journal)
Ramkumar, S. Manian. “Packaging and Assembly of Microlectronic Devices and Systems.” Nanotechnology For Telecommunications. ed. Sohail Anwar. Boca Raton: CRC Press, 2010. 335-371. Print.
Published Article
Dhanasekaran,Rangaraj, Harish Gadepalli, and S. Manian Ramkumar. “Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly.” SMTA International Conference Proceedings, 25-28 Oct. 2010. n.p. Print. " É *

Currently Teaching

RMET-600
MMSI Graduate Seminar
0 Credits
This course provides students that are new to the MMSI program an opportunity to develop an understanding of the department’s research activities. The students will become more knowledgeable about the Manufacturing & Mechanical Systems Integration program, career options, the capstone and thesis project process (finding an advisor, required documentation and policies regarding completing a project on co-op) and department policies and procedures related to successful completion of the MMSI program.
RMET-798
Continuation of Capstone
0 Credits
Continuation of Capstone

In the News

More News  
More News