Thomas Palone
Reliability and Packaging Engineer
Department of Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
Thomas Palone
Reliability and Packaging Engineer
Department of Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
In the News
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June 12, 2024
![the cover of a paper titled High-Dimensional quantum entanglement on a chip is shown.]()
Ph.D. student is lead author on paper published on cover of 'Optica Quantum'
Microsystems engineering Ph.D. student Evan Manfreda-Schulz ’20 (physics) accomplished something many academic researchers aim for when his first paper was published on the cover of Optica Quantum.
