Ivan Puchades Headshot

Ivan Puchades

Associate Professor

Department of Electrical and Microelectronic Engineering
Kate Gleason College of Engineering

585-475-7294
Office Location

Ivan Puchades

Associate Professor

Department of Electrical and Microelectronic Engineering
Kate Gleason College of Engineering

Education

BS, MS, Ph.D., Rochester Institute of Technology

Bio

Dr. Puchades completed his Ph.D. on thermally actuated MEMS resonators to measure the viscosity of fluids in 2011. In 2016 he completed a 2-year postdoctoral appointment providing innovating insight on the physical characteristics of doped electronic-type-separated single wall carbon nanotubes and developing novel devices. He currently teaches undergraduate courses in Electrical Engineering and has taught graduate-level Microelectronic Engineering courses in MEMS Design, Fabrication and Test.

His current research interests include collaborations to explore high frequency and sensing applications of new materials such as carbon nanotubes and other nanomaterials (graphene, 2D metal chalcogenides, phosphorenes, borophene, nanowires, 2-dimensional electron gas (2DEG) heterostructures, etc.). He is also interested in expanding research and development of MEMS devices and applications of thermal, electrostatic and piezoelectric MEMS resonators, piezoelectric energy harvesting, multi-sensor networks, and system integration.

Dr. Puchades has significant industry experience having worked as an RF device engineer and BiCMOS technology development engineer for Motorola and Freescale Semiconductor in Phoenix, Arizona from 2000 to 2005. He was responsible for CMOS and high-voltage technology integration at the 0.18-µm node. While at Freescale he organized a Device Physics Seminar for process engineers, obtained his Six-Sigma green belt accreditation and lead the resolution of several high-impact device engineering issues. He coop’d at Advanced Vision Technologies and National Semiconductor during his undergraduate studies.

585-475-7294

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Selected Recent Publications

Experimental design for CO2 laser cutting of sub-millimeter features in very large-area carbon nanotube sheets, AR Bucossi, JE Rossi, BJ Landi, I Puchades 
Optics & Laser Technology 134, 106591  2021

 
Platinum nanometal interconnection of copper–carbon nanotube hybrid electrical conductors, AP Leggiero, SD Driess, ED Loughran, DJ McIntyre, RK Hailstone, ... 
Carbon 168, 290-301 1 2020 


Antenna Arrays as Millimeter-Wave Wireless Interconnects in Multichip Systems 
RS Narde, J Venkataraman, A Ganguly, I Puchades, IEEE Antennas and Wireless Propagation Letters 19 (11), 1973-1977  2020 


Integrated Titanium-Carbon Nanotube Conductors via Joule-Heating Driven Chemical Vapor Deposition, DJ McIntyre, AP Leggiero, RK Hailstone, I Puchades, CD Cress, BJ Landi, ECS Transactions 97 (7), 321  2020 
 

Interfacing Copper and Carbon Nanotubes with Titanium for Enhanced Electrical Performance, DJ McIntyre, R Hirschman, I Puchades, BJ Landi, ECS Meeting Abstracts, 678  2020 


Enhanced copper–carbon nanotube hybrid conductors with titanium adhesion layer 
DJ McIntyre, RK Hirschman, I Puchades, BJ Landi, Journal of Materials Science 55 (15), 6610-6622 4 2020

Ivan Puchades, Jamie E. Rossi, Cory D. Cress, Eric Naglich, and Brian J. Landi. “Carbon nanotube thin-film antennas,” ACS Applied Materials & Interfaces, 2016, 8 (32), pp 20986–20992

Jamie E. Rossi, Cory D. Cress, Sheila M. Goodman, Nathanael D. Cox, Ivan Puchades, Andrew R. Bucossi, Andrew Merrill, and Brian J. Landi. 'Enhanced Electrical Transport in Carbon Nanotube Thin Films through Defect Modulation.' The Journal of Physical Chemistry C 120, no. 28 (2015): 15488-15495.

Ivan Puchades, Colleen C. Lawlor, Christopher M. Schauerman, Andrew R. Bucossi, Jamie E. Rossi, Nathanael D. Cox, Brian J. Landi, “Mechanism of chemical doping in electronic-type-separated single wall carbon nanotubes towards high

Currently Teaching

EEEE-281
3 Credits
Covers basics of DC circuit analysis starting with the definition of voltage, current, resistance, power and energy. Linearity and superposition, together with Kirchhoff's laws, are applied to analysis of circuits having series, parallel and other combinations of circuit elements. Thevenin, Norton and maximum power transfer theorems are proved and applied. Circuits with ideal op-amps are introduced. Inductance and capacitance are introduced and the transient response of RL, RC and RLC circuits to step inputs is established. Practical aspects of the properties of passive devices and batteries are discussed, as are the characteristics of battery-powered circuitry. The laboratory component incorporates use of both computer and manually controlled instrumentation including power supplies, signal generators and oscilloscopes to reinforce concepts discussed in class as well as circuit design and simulation software.
EEEE-480
4 Credits
This is an introductory course in analog electronic circuit analysis and design. The course covers the following topics: (1) Diode circuit DC and small-signal behavior, including rectifying as well as Zener-diode-based voltage regulation; (2) MOSFET current-voltage characteristics; (3) DC biasing of MOSFET circuits, including integrated-circuit current sources; (4) Small-signal analysis of single-transistor MOSFET amplifiers and differential amplifiers; (5) Multi-stage MOSFET amplifiers, such as cascade amplifiers, and operational amplifiers; (6) Frequency response of MOSFET-based single- and multi-stage amplifiers; (7) DC and small-signal analysis and design of bipolar junction transistor (BJT) devices and circuits; (8) Feedback and stability in MOSFET and BJT amplifiers.
EEEE-499
0 Credits
One semester of paid work experience in electrical engineering.
ENGR-899
3 Credits
This course is used by students who plan to study a topic on an independent study basis. The student and instructor must prepare a plan of study and method of evaluation for approval by the program director prior to course registration.
MCEE-770
3 Credits
This course will provide an opportunity for the student to become familiar with the design, fabrication technology and applications of Microelectromechanical systems. This is one of the fastest growing areas in the semiconductor business. Today's MEMS devices include accelerometers, pressure sensors, flow sensors, chemical sensors, energy harvesting and more. These devices have wide variety of applications including automotive, consumer, military, scientific, and biomedical. Students will select a MEMS device/project to be made and then design, fabricate, test, prepare a project presentation and final paper.