An introduction to the basics of integrated circuit fabrication. The electronic properties of semiconductor materials and basic device structures are discussed, along with fabrication topics including photolithography diffusion and oxidation, ion implantation, and metallization. The laboratory uses a four-level metal gate PMOS process to fabricate an IC chip and provide experience in device design - and layout (CAD), process design, in-process characterization and device testing. Students will understand the basic interaction between process design, device design and device layout.

An introduction to the fundamentals of electrostatic, magneto-static and time varying fields that culminate with the Maxwell's equations, continuity and Lorentz force that govern the EM phenomena. Importance of Laplace's and Poisson's equations in semiconductor applications is described. Electromagnetic properties of material media are discussed with emphasis on boundary conditions. Plane wave solution of Maxwell's equations is derived and discussed in loss-less and lossy media. Applications in optics include reflection/refraction and polarization of light. A strong knowledge of vector calculus is desired.

This course focuses on the deposition and etching of thin films of conductive and insulating materials for IC fabrication. A thorough overview of vacuum technology is presented to familiarize the student with the challenges of creating and operating in a controlled environment. Physical and Chemical Vapor Deposition (PVD & CVD) are discussed as methods of film deposition. Plasma etching and Chemical Mechanical Planarization (CMP) are studied as methods for selective removal of materials. Applications of these fundamental thin film processes to IC manufacturing are presented.

This course introduces the beginning graduate student to the fabrication of solid-state devices and integrated circuits. The course presents an introduction to basic electronic components and devices, lay outs, unit processes common to all IC technologies such as substrate preparation, oxidation, diffusion and ion implantation. The course will focus on basic silicon processing. The students will be introduced to process modeling using a simulation tool such as SUPREM. The lab consists of conducting a basic metal gate PMOS process in the RIT clean room facility to fabricate and test a PMOS integrated circuit test ship. Laboratory work also provides an introduction to basic IC fabrication processes and safety.

This course focuses on the deposition and etching of thin films of conductive and insulating materials for IC fabrication. A thorough overview of vacuum technology is presented to familiarize the student with the challenges of creating and operating in a controlled environment. Physical and Chemical Vapor Deposition (PVD & CVD) are discussed as methods of film deposition. Plasma etching and Chemical Mechanical Planarization (CMP) are studied as methods for selective removal of materials. Applications of these fundamental thin film processes to IC manufacturing are presented. Graduate paper required.

Dissertation research by the candidate for an appropriate topic as arranged between the candidate and the research advisor.

Continuation of Thesis