Nanophotonics
Integrated Photonics
The RIT Integrated Photonics Group develops Photonic Integrated Circuits (PICs) for high performance computing, communication, and sensing systems.
What We Do
Quantum Integrated Photonics
We are developing Quantum-PICs (Q-PICs) for Quantum computing, communication and sensing applications. The Q-PICs are optimized to have ultra-low loss devices for generating, entangling, manipulating and detecting photonics quantum bits (qubits).
Visible Integrated Photonics
Visible wavelength PICs are key for quantum, sensing, display, AR/VR applications. Our group is realizing visible wavelengths PICs based on Silicon Nitride and wide bandgap semiconductors.
Hybrid/Heterogeneous Integration
High performance PICs require the integration of light sources, electro-optic and nonlinear optical materials, and electronic chips. We are developing approaches for integrating these materials (III-V's, Lithium Niobate and more) & devices onto silicon photonic PICs at both the die and wafer level.
PIC Packaging
Packaging PICs remains one of the most significant challenges of realizing complex PIC functionalities and deploying them into systems. We have the equipment and processes for complete packaging, including, fiber attachment, die bonding, wire bonding, flip-chip integration. The key packaging equipment we have at RIT include a ficonTEC CL1500 fiber attach & microassembly system (single fibers, fiber arrays, microlens arrays), Vanguard Automation SONATA 1000 for Photonic Wire Bonding system, and X-celeprint (Xdisplay) Micro-Transfer Printing System.
Education and Workforce Development
Our group is committed to the education and training of an emerging integrated photonics workforce. Professor Preble teaches courses and offers workshops that cover the design, simulation/modeling, fabrication, testing and packaging of PICs. See below for PIC Training Opportunities.
PIC Training Opportunities
- Photonic Integrated Circuits 1 (PIC1) - An online edX course that gives a deep-dive into fabless photonics design using industry-leading Electronic Photonic Design Automation (EPDA) software to model, simulate, layout and error-check a photonic integrated circuit for high-tech applications. The course has trained hundreds and is offered several times a year.
- AIM Photonics Testing & Packaging Workshops – Hands-on training of testing, analyzing and packaging PICs in Rochester, NY:
- Passive PIC Testing: Coupling, Loss, Interference Resonance
- Active PIC Testing: Electro-optic Modulator, Photodetection, Multiplexing
- Packaging: Dicing, Die Bonding, Wire Bonding, Fiber Attachment and Metrology
