Kandlikar and Shukla present at IEEE ITherm; Shukla wins best poster award
Satish Kandlikar, Gleason Professor in the Department of Mechanical Engineering, and Maharshi Shukla, a Ph.D. engineering candidate, presented on Novel Subcooled Boiling Chamber with Submerged Condensation for High Heat Flux Removal for Data Center Application at the IEEE 2024 ITherm conference in Denver. Out of over 200 proceedings, Shukla won the Best Poster in the System Level Thermal Management Track.
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