L3Harris - Linear Thin Film Applicator Cleaning Process

Location

Engineering Hall (ENG/017) - Engineering Hall

At Imagine RIT, our exhibit will showcase an improved manual cleaning process for SMT equipment components, designed to efficiently remove glue and flux while minimizing operator effort and downtime. Visitors will watch a live demonstration where we will show the step-by-step cleaning process used to remove hardened glue and flux from SMT nozzles and components. They will see a before-and-after comparison, highlighting how the new method improves efficiency and effectiveness. Throughout the demonstration, we will explain the challenges of manual cleaning, the tools and solvents used, and how our process minimizes cleaning time while ensuring high-quality results. To enhance understanding, we will display informational posters and digital visuals that explain the chemistry behind glue and flux removal, as well as the Lean Six Sigma principles applied to streamline the process. Visitors will also learn about the impact of insufficient cleaning, including potential equipment downtime and defects in SMT assembly. While visitors won't interact directly with the cleaning process, they will have the opportunity to ask questions and gain insights into how engineering, chemistry, and process optimization work together to solve real-world manufacturing challenges. This exhibit is designed to engage students, tech enthusiasts, and professionals interested in lean manufacturing, materials science, and process improvement, offering a clear and informative look at an essential industrial process.

Location

Engineering Hall (ENG/017) - Engineering Hall

Topics

Exhibitor
Kirya Linda
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Matthew Martin
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Advisor(s)
John Bonzo

Organization
This is for our Multidisciplinary Senior Design project.


Thank you to all of our sponsors!