Mario Ciminelli, BSME Rochester Institute of Technology 1984, joined RIT in 2018 as a staff engineer in the Microsystems Ph.D. Department. His areas of interest include Microelectronic packaging, MEMS, sensor design, new product development and commercialization. At RIT, he is applying his many years of microelectronic packaging design experience to the area of Photonics packaging, where he is working on the areas of fiber attach, die attach, and photonic chip package design. Prior to joining RIT, Mario worked at a number of companies designing the microelectronic packaging of MEMS sensors and devices which were sold into multiple markets (consumer, industrial, automotive). This included Eastman Kodak where he worked on Image Sensors, Inkjet Printheads, and Metal Mesh touch sensors. Mario has 14 patents, many of which either solved a product problem or enabled meeting previously unmet requirement.