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College of Engineering Technology

Golisano College of Computing and Information Sciences College of Engineering Technology College of Art and Design College of Liberal Arts College of Science Saunders College of Business Golisano Institute for Sustainability Kate Gleason College of Engineering National Technical Institute for the Deaf Other Degree Granting Units
Civil Engineering Technology, Environmental Management and Safety Dean's Office Department of Electrical and Computer Engineering Technology Department of Graphic Media Science and Technology Department of Service Systems Manufacturing and Mechanical Engineering Technology Packaging Science All Departments

Faculty Scholarship 2010

Packaging Science

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Changfeng GeDirector of APC Center for Packaging Innovation at RIT

Associate Professor
Packaging Science
College of Engineering Technology

2010 Submissions

Published Article

Ge, Changfeng, and Daniel Goodwin. “Compression Strength Formulas for Bliss Cases and Wrap-around Boxes.” Journal of Applied Packaging Research, 4.3 (2010): 155-167. Print. «

Ge, Changfeng. “Adding Barrier-shrink-film to a PET bottle to improve barrier properties.” Journal of Applied Packaging Research, 4.2 (2010). Print. «

Ge, Changfeng, and Daniel Goodwin. “Application of Experimental Modal Analysis to determine natural frequencies of stacked corrugated boxes.” 17th IAPRI World Conference on Packaging, 12-15 Oct. 2010. n.p. Print. *

Published Book

Ge, Changfeng. Package Structure and Mechanism Design with SolidWorks 2010. Mission, KS: SDC Publications, 2010. Print.

Editor (book or journal)

Changfeng Ge. Journal of Applied Packaging Research. DEStech Publications, Inc., 2010. Print.

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Daniel GoodwinProgram Chair of Packaging Science

Professor
Packaging Science
College of Engineering Technology

2010 Submissions

Published Article

Ge, Changfeng and Daniel Goodwin. “Compression Strength Formulas for Bliss Cases and Wrap-around Boxes.” Journal of Applied Packaging Research, 4.3 (2010): 155-167. Print. *

Formal Presentation

Goodwin, Daniel, Changfeng Ge, Thomas Kausch and John Siy. “Application of a Creep Measurement Technique to Predict Time to Failure and Compression Strength of Bliss Cases and Wrap-around Boxes.” BAM/IAPRI Symposium on Packaging Research and Development. Berlin, Germany. 12 May 2010. Presentation.

Ge, Changfeng and Daniel Goodwin. “Application of Experimental Modal Analysis to Determine Natural Frequencies of Stacked Corrugated Boxes.” 17th IAPRI World Conference on Packaging. Tianjin, China. 13 Oct. 2010. Presentation.

Published Book

Goodwin, Daniel and Dennis Young. Protective Packaging for Distribution. Lancaster, PA: DEStech Publications, Inc., 2010. Print.

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Karen Proctor

Professor
Packaging Science
College of Engineering Technology

2010 Submissions

Formal Presentation

Proctor, Karen. “Packaging Sustainability and the Need for Pre-Shipment Testing”. Sustainable Packaging Coalition Annual Meeting. 19-21 April 2010. Presentation.

Proctor, Karen. “Packaging Sustainability and the Products You Purchase”. American Society for Engineering Education - St. Lawrence Section Conference. Rochester, NY. 26-27 March 2010. Presentation.

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S. Manian RamkumarDirector of Center for Electronics Manufacturing and Assembly
Program Chair of MS-Manufacturing and Mechanical Systems I

Professor
Packaging Science
College of Engineering Technology

2010 Submissions

Published Article

Dhanasekaran, Rangaraj, Harish Gadepalli, and S. Manian Ramkumar. “Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly.” SMTA International Conference Proceedings, 25-28 Oct. 2010. n.p. Print. " É *

Editor (book or journal)

Ramkumar, S. Manian. “Packaging and Assembly of Microlectronic Devices and Systems.” Nanotechnology For Telecommunications. ed. Sohail Anwar. Boca Raton: CRC Press, 2010. 335-371. Print.

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