Industry Training

5-Day Training with Hands-on Laboratory

Course Description
This training course is aimed at providing a thorough understanding of Surface Mount Technology (SMT) and advanced packaging principles, practice, processes, equipment and design. This course will also include extensive discussions on process parameters, process characteristics, identifying and correcting defects.  This course will provide the participants with a strong foundation needed for implementing the SMT process and supporting printed circuit board design. The knowledge gained from this training will help companies enhance product development and manufacturing. The course also includes sufficient coverage and comparison of lead-free and a one and a half day equivalent of hands-on training in the laboratory, equipped with state-of-the-art equipment. 

3-Day Training with Hands-on Laboratory

Course Description
This training course is an abbreviated version of the 5-Day training. It is aimed at providing a sufficiently good understanding of Surface Mount Technology (SMT) and advanced packaging principles, practice, processes, equipment and design. This course will also include discussions on process parameters, process characteristics, identifying and correcting defects.  This course will provide the participants with a good foundation needed for implementing the SMT process. The knowledge gained from this training will help companies enhance product development and manufacturing. The course also includes sufficient coverage and comparison of lead-free and a one-day equivalent of hands-on training in the laboratory equipped, with state-of-the-art equipment. 

Who should attend?

• People with very little or no background in SMT
• Process, Design, Test and Quality Engineers
• Process and Quality Technicians
• Operators

Topical Outline

1. Electronics Packaging
   • Levels of Packaging
   • Functions of Packaging
   • Electrical Considerations
   • Mechanical Considerations
   • Material Considerations
   • Thermal Considerations and
   • Environmental Considerations
2. Printed Wiring Board Materials & Fabrication Overview
3. Through-Hole Technology Overview
   • Components - Definition and Terminology
   • Component Packaging for Automatic Insertion
   • Automated Assembly Line for Through-Hole Technology
   • Axial, Radial and DIP Component Insertion Sequence
   • Variables Affecting Automatic Insertion
   • Wave Soldering
4. Surface Mount Technology Overview
   • SMT Components Overview
   • Comparison of IMT and SMT Components
   • SMT Assembly Process
   • Types of SMT Assembly
   • Advantages and Disadvantages of SMT
5. SMT Components (Detailed Discussion of Terminology and Specifications)
   • The contents of this chapter include details of passive, active and advanced technology components (BGA, CSP, Flipchip, etc.)
6. Stencil Printing
   • Factors affecting the Print Process
   • Stencil - Construction & Terminology
   • Stencil Manufacturing
     • Laser Cut
     • Chem Etch
     • Electroform
   • Solder Paste
     • Types of Solder Paste
     • Terminology - Rheology, Solder Powder, Thixotropic, etc.
       • Flux
       • Types
       • Constituents - Activators, Rosin/Resin, Solvent
     • Tackiness
     • Packaging of Solder Paste
     • Handling and Safety
   • Squeegee Types
   • Solder Paste Printer Types
   • Print Parameters
     • Squeegee Speed
     • Print Stroke
     • Squeegee Pressure
     • Squeegee Downstop
     • Snap-Off
     • Angle of Attack
     • Squeegee Hopover
     • Squeegee Durometer
   • Process Characteristics
     • Print Life
     • Print Definition
     • Paste Height
     • Scooping
     • Bridging
     • Slumping
7. Adhesive Dispensing
   • Characteristics of Adhesives
   • Application Methods & Factors Effecting Dot Size
   • • Pin Transfer
     • Pressure Syringe
     • Screen Printing
     • Positive Displacement
     • Jetting
     • Process Considerations
   • Environmental Considerations
   • Adhesive Classification
   • Common Application Problems
8. Component Placement
   • Factors Influencing Use of Automated Pick & Place Equipment
   • Packaging of SMT Components for Automated Placement
   • Classification of Placement Machines
     • Entry Level
     • Chip Shooter
     • Flexible-Medium Volume
     • Mass Placement
     • Odd Component
     • In-Line Placement
     • Mass Placement
9. Soldering of Surface Mount Components
   • Vapor Phase Soldering
     • Advantages & Disadvantages
   • Reflow Soldering
     • Radiant IR
     • Forced Convection
     • Benefits of Nitrogen Over Air
   • Construction of an IR Oven
   • Oven Profiling
   • Causes of Non-Uniform Heating
   • Wave Soldering
     • Process Steps
     • Wave Configurations
     • Concerns & common defects
10. Cleaning SMT Assemblies
    • Why Clean?
    • Types of Cleaning
      • Solvent
      • Aqueous
      • Semi-Aqueous with Terpene
      • Aqueous with Saponiphied Water
      • Aqueous Cleaning with Deionized Water
    • No Clean
    • Measurement of Cleanliness
11. Inspection Techniques & defect identification
12. Post Assembly Testing
    • Types of Testing
      • Manual Testing
      • Populated Substrate Shorts Testing
      • In-Circuit Analyzer
      • In-Circuit Testing
    • ICT Fixturing
    • Fixtureless ICT
    • Functional Testing
    • In-Product Testing
13. SMT Rework and Repair
    • Why Rework and Repair?
    • Rework and Repair Process
    • Tips for effective rework & repair
    • Materials & Tools Associated with Rework and Repair
    • Parameters Associated with Rework and Repair
    • Process Considerations
    • Environmental Considerations
14. General Guidelines for Designing with SMT
    • Terminology
    • Land Pattern Design and Solderability
    • Recommended Component Orientation for Wave Soldered Substrates
    • Track and Via Design
    • Routability
    • Manufacturability
    • Electrical Considerations
    • Thermal Considerations
    • Testability
    • Cost Considerations
15. Automated Optical Inspection (AOI)
    • Sequence of Operation
    • Illumination Techniques
      • Front Lighting
      • Back Lighting
    • Sources of Illumination
    • Optics
    • CCD Camera
      • Pixel Resolution
    • Image Processing Unit
    • Applications in SMT Process
    • Issues

1-Day Tutorial

Course Description
This course will provide an introductory understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include coverage of PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, and process control. Critical design tips for ease of manufacture and assembly will be introduced throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. Basic laboratory demonstrations are included.

Who should attend?

• People with very little or no background in SMT
• Process, Design, Test and Quality Engineers
• Process and Quality Technicians
• Operators
• Marketing, Sales and Purchasing Staff
• Managers

After completing this course, you should be able to:

1. Identify various SMT components, their terminology and nomenclature
2. Understand what a PCB is and also the need for effective thermal management
3. Identify types of mixed technology PCB assemblies and their assembly sequence
4. Understand the influence of design on the ease of manufacturing and assembly
5. Understand thoroughly the entire assembly process and the various parameters that influence it.
6. Understand the influence of various materials such as solder paste, adhesives, flux, etc.
7. Detect assembly process defects and troubleshoot them.
8. Evaluate equipment required for setting up assembly lines
9. Understand Lead Free Implementation and Issues.

Topical Outline

1. Electronics Packaging & Levels
   • Functions of Packaging
   • Thermal management issues
   • PCB Packaging
   • Assembly Types
   • Assembly Process Sequence
2. PCB Types, Materials and Manufacturing
3. Overview of Through Hole Technology
   • Component Types & Process Steps
4. Overview of Surface Mount Technology
   • Passive Component Types
   • Active Component Specifications
   • Active Component Types (ICs)
   • Common SMT assembly process
5. Stencil Printing
   • Solder Paste-Characterization, Types, Handling & Safety
   • No-Lead Solder and its Impact
   • Stencils and Squeegees-Materials, Types & Manufacturing
   • Print Parameters
   • Process requirements for Lead Free
   • Print Characteristics, Defects and Corrective Action
6. Adhesive Dispense
   • Adhesive Types, Selection & Dispensing Techniques
   • Inspection
   • Reflow Curing
7. Component Placement
   • Factors Influencing the use of Automated Placement Equipment
   • Machine Configurations & Types
   • Component Packaging for Automated placement
8. Soldering
   • Reflow Soldering
     • Typical Reflow Profile
     • Profiling & its importance-How to?
     • Factors affecting good reflow
     • Lead Free Solder and Profiling Changes
   • Wave Soldering
     • Changes needed for Lead Free Solder
     • Process Sequence & Defects
9. Cleaning Materials, Process, & Testing for cleanliness
10. Inspection Techniques, Assembly Defect Identification and Corrective Action
11. Testing of PCB Assemblies
12. Rework and Repair

1-Day Workshop 

Course Description
This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages. Packages discussed in this course include BGAs, CSPs, Flip Chip, Wafer Level CSPs, COB, TAB, MCMs and Stacked Packages. A thorough comparison of the advantages and disadvantages of each component type, as well as their implementation requirements will be presented. High density interconnection, thermal management requirements and micro-via technology will also be discussed. The course will also cover assembly process details when using these devices in lead based and lead free assembly. Half day equivalent of hands-on education will be provided in the state-of-the-art laboratory using advanced technology PCB assemblies.

Who should attend?

• People with prior background in SMT
• Process, Design, Test and Quality Engineers
• Process and Quality Technicians
• Marketing, Sales and Purchasing Staff
• Managers

After completing this course, you will be able to:

1. Identify various advanced components packages and their nomenclature
2. Understand what a PCB is and also the need for effective thermal management
3. Understand the assembly process required and the various parameters that influence the use of advanced component packages
4. Understand the influence of various materials such as solder paste, adhesives, flux, underfill, encapsulation, etc.
5. Evaluate equipment requirements for advanced component assembly.

Topical Outline

1. Introduction
2. Electronics Packaging & Levels
   • What is electronics packaging?
   • Levels of Electronics Packaging
   • Thermal Management
   • Substrate Properties
3. Active SMT Components
   • Active Component Types
   • Active Component Configurations
   • Active Component Specifications
   • IC Packaging Trends
   • Package Evolution
   • Factors Influencing the Package Evolution
4. Ball Grid Array (BGA) Packages
   • Why are BGAs so popular?
   • Manufacture of BGAs
   • BGA Configurations
5. Plastic BGAs
   • Component Construction & Details
   • Plastic BGA Benefits & Issues
   • Self-Centering of PBGAs
6. Ceramic BGA (CBGA)
   • Component Construction & Details
   • Ceramic BGA Benefits & Issues
7. Tape BGA (TBGA)
   • Component Construction & Details
   • Tape BGA Benefits & Issues
8. Super BGA
   • Component Construction & Details
9. Dimpled BGA (DBGA)
10. Chip Scale Packaging (CSP)
    • CSP Types
    • CSP Packages
    • CSP Packaging for Automated Assembly
    • Factors Influencing Increased Interest in CSP Packages
11. BGA Assembly Process
    • X-Ray Inspection of BGA Assembly
    • Rework & Repair of BGA Assembly
12. Flip Chip Attach
    • What is flip chip?
    • Flip Chip Attach-Size Advantage
    • Flip Chip Bumping
    • Flip Chip Packaging for Assembly
    • Flip Chip Assembly Process
    • What is Encapsulation?
    • Flip Chip Attach-Benefits
    • Flip Chip Attach-Issues
13. Wafer Level Packaging & I/O Redistribution
14. Ceramic Column Grid Array (CCGA)
    • Component Construction & Details
    • CCGA Solder Joint-Thermal-Fatigue-Induced Failure
15. Chip-On-Board (COB) Technology
    • COB Assembly Process
    • Wire Bonding
    • Wire Bonding Options
    • Glob Top Encapsulation
    • COB-Benefits & Issues
16. Tape Automated Bonding (TAB)
    • Component Details
    • Assembly Process
    • Benefits & Issues
17. Multi-Chip-Module (MCM)
    • MCM Constructions
    • Benefits & Issues
18. Conductive Adhesives

Half-Day Workshop

Course Description
The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications. Topics include an in-depth look at stencils, aperture design, stencil selection, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. Half day equivalent of hands-on education provided in the state-of-the-art laboratory will allow participants to experiment with the process parameters. 

Who should attend?

• Process, Design, Test and Quality Engineers
• Process and Quality Technicians
• Operators
• Managers

After completing this course, you will be able to:

1. Understand the stencil printing process and the process parameters, thoroughly.
2. Understand the importance and the influence of solder paste, flux, temperature, humidity, board support and machine setup.
3. Evaluate materials such as paste, stencil and squeegee for efficient printing
4. Understand the various solder paste constituents and types of paste
5. Specify stencils, solder paste and printer requirements for various applications
6. Understand Stencil construction and features for efficient paste transfer
7. Understand squeegees and the recent advances in print technology
8. Evaluate in-coming raw materials and procedure for qualifying vendors
9. Understand the print process for adhesive applications.

Topical Outline

1. Importance of stencil printing process
2. Factors that affect the stencil printing process
3. An in-depth look at the various factors
   • Stencils
     • Construction
     • Materials
     • Manufacturing Techniques
     • Dimensional Accuracy
     • Surface and Wall Finish
     • Calculating area aspect ratios
     • Solder paste efficiency transfer and Area Aspect Ratio (AAR)
     • Aperture design for fine pitch and area array packages
   • Solder Paste
     • Solder Paste Thixotropic Rheology, Solder Powder, etc.
     • Flux Types
     • Flux Constituents - Activators, Rosin/Resin, Solvents
     • Solder Particles-Alloy composition, Shape, Size, Distribution and Percent Metal Content
     • Paste types
     • No-Clean and No-Lead Solder Paste Processing
     • Tackiness-Shelf Life and Print Life
     • Packaging of Solder Paste and Storage
     • Handling and Safety
   • Squeegee
     • Squeegee Materials
     • Types
     • Advanced print head technologies
   • Solder Paste Printer Types & Features
     • Manual
     • Semi-Automatic
     • Fully Automatic
   • Print Parameters
     • Squeegee Speed
     • Print Stroke
     • Squeegee Pressure
     • Squeegee Downstop
     • Snap-Off
     • Angle of Attack
     • Squeegee Hopover
     • Squeegee Durometer
   • Other Parameters
     • Temperature and Humidity
4. Process Characterization
5. Solder Paste Inspection Techniques 2D vs. 3D inspection
6. Defect Identification and Corrective Action
7. Stencil Printing for Adhesive Applications

1-Day Tutorial

Course Description
The reflow soldering process is another key process in surface mount electronics assembly after stencil printing. The soldering parameters combined with the surface finish of the PCB and components, influence the formation and quality of the solder joint in surface mount PCB assembly. This course will provide a thorough understanding of the reflow process for tin-lead and lead free soldering. Topics include an in-depth look at the various soldering methods, mechanism for solder joint formation, intermetallic formation, reflow parameters, effect of reflow parameters, thermocouple attachment and profiling, importance of profiling, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the soldering process and its influence on assembly yield. Half day equivalent of hands-on education provided in the state-of-the-art laboratory will allow participants to experiment with the process parameters and observe the process outcomes. Participants will also generate reflow profiles for a couple of PCB assemblies.

Lean Manufacturing Training

Half Day Lean Overview
Participants will be exposed to a broad list of Lean tools and definitions. Lean philosophy of continuous improvement will be discussed. Examples of application of lean tools to the workplace will be reviewed. Participants will perform a simulation exercise that demonstrates how the lean tools and concepts can have an impact on operations.

Half Day 5S/ Visual Controls
Implementation of 5-S is important to the goals of Lean because it allows quick determinations of workplace status. Likewise, Visual Controls provide a means of communicating what needs to be done, when, where, by whom, how, and how much. Participants will learn what is involved in implementing a sustainable 5-S program. They will be taught the steps in 5-S, what a 5-S audit should look like, and they will have a classroom game exercise that will reinforce the central concept of 5-S and why it is not simply a 'clean-up' program. In addition, participants will learn about Visual Controls, including examples that will stimulate their thoughts on how they can apply these concepts to real world situations.

Half Day Value Stream Mapping (VSM)
Participants will review the theory and value of VSM and why it serves as a road map for an organization’s Lean journey. Included will be discussion surrounding process mapping, information flow, material flow, and distribution methods. Participants will also learn how to draw a VSM and how to progress from a current state to a future state map. At the conclusion of this module, participants will be able to construct both a current state map as well as a future state map.

1-Day Tutorial

Course Description
Electronic Assembly Technology with Lead (Pb)-free interconnection alloys is relatively new in comparison to the long history and experience with tin-lead eutectic solder. Compositional variations of the ternary tin-silver copper can have significant impact on the interconnection behavior under different loading conditions. While the popular solder alloy is a Sn-Ag-Cu three-component system, the interconnection itself can be a five or six component system owing to the different component termination and the printed wiring board finishes utilized. Understanding of the microstructural aspects of the lead free alloys is still in its infancy. New failure mechanisms, different from the ones seen with eutectic solders, have been reported. Influence of minor elements on the behavior of Pb-free solders is not adequately explored. There is an urgent need for a better understanding of lead free solders to ensure product performance and reliability under a broad range of use environment since their implementation has already started. In this course will be explored the fundamental materials aspects, microstructural aspects, unique failure modes & mechanisms along with a discussion of prevention methods.

3-Day Hands-on Training

Course Description
This is a 3-day worker proficiency course focusing on lead-free soldering of surface mount components. This class will be conducted with up to 8 students per class. Initial course discussion (about 3 hours) focuses on lead-free solder, lead-free finishes, lead-free materials, lead-free migration, and lead-free impact on rework operations. A review of soldering basics follows. Objectives of this review are to assure student understanding of soldering, the roles of solder, flux, and heat sources, and how these are applied in SMT soldering. The balance of the class is directed to hands-on SMT lead-free soldering exercises. These include installation and removal of surface mount chip, gull wing, and J-lead components. Each exercise is preceded by instructor demonstration of the assembly/removal technique. All assembly/soldering must meet IPC Class 3 requirements. Student workmanship is evaluated jointly by student and instructor via microscope and color monitor projection. An (optional) SMT soldering exercise on Day 3 verifies student understanding and application of acceptable soldering principles. Reference workmanship standard used in class may be either IPC J-STD-001D or IPC-A-620D. Both include reference to lead-free solders.

3-Day Hands-on Training

Course Description
This is a 3-day worker proficiency course focusing on Sn/Pb soldering of surface mount and through hole components. This class will be conducted with up to 8 students per class. Students attending this 3-day combined SMT/Thru-Hole soldering course are assumed to have been certified to IPC-J-STD-001 and require additional soldering skills. The morning of the first day will be lecture on the basics of soldering and inspection. Discussion topics will include: soldering safety; ESD; core solder and its properties; the importance of flux; soldering tips, their care, and selection; through-hole soldering principles, and SMT soldering principles. Also addressed is SMT/TH inspection criteria and SMT/TH solder defect identification and correction, using IPC standards as reference. The balance of the class is directed to hands-on soldering exercises. These include installation and removal of through-hole axial, radial, and DIP devices and installation and removal of surface mount chip, gull wing, and J-lead components. Each exercise is preceded by instructor demonstration of the assembly/removal technique. Student workmanship is evaluated jointly by student and instructor via microscope and color monitor projection.

Course Description
The IPC, nationally recognized as an electronics manufacturing trade association, has issued the J-STD-001D "Joint Industry Standard" which prescribes the practices and requirements for manufacture of soldered electrical and electronic assemblies. Rather than prescribing the manufacturing process, the J-STD-001D describes the materials, methods, and acceptance criteria the completed product shall meet. On completion of this course, the student will understand the requirements of J-STD-001D, related standards, and how these apply to their positions.

This is a modularized course, consisting of one mandatory 8-hour module, and four (4) additional 8-hour modules. This provides focused training for each student, depending upon specific training needs of the employer.

The student should have basic through-hole and surface mount soldering skills prior to attending this course. Student written test scores for each module will be averaged together. Successful completion of this course requires a combined score of 70% or higher for written examinations and a minimum score of 70% for each lab.

Course Content

Module 1. General Study of All Requirements. (Mandatory)
This module provides an overview of J-STD-001D. It consists of lecture, review, a 25-question open-book and 25-question closed-book examination. The student must complete this module with a combined score of 70 or higher before proceeding to further modules.

Module 2. Wires and Terminals
This 8-hour module consists of lecture, demonstration, and student laboratory in preparing and soldering wires to terminals and demonstrating acceptable soldering of common wire/terminal configurations. A minimum score of 70 is required on a 25-question open book examination.

Module 3. Through-Hole Components
An 8-hour module, the class includes lecture, instructor demonstration, and student laboratory in hand soldering through-hole components to a board. On completion, the student must demonstrate proficiency by acceptably soldering through-hole components and completing a 25-question open book examination with a minimum passing score of 70.

Module 4. Surface Mount Components
The 8-hour module consists of lecture, instructor demonstration, and student laboratory in hand soldering common surface mount components to a board. To successfully complete the module, the student must submit acceptable surface mount solder samples and complete a 25-question open book examination with a minimum score of 70.

Module 5. Inspection Methodology
This 8-hour module includes lecture, inspection laboratory, review and module examination in inspection of through-hole and surface mount assemblies. Focus of this class is Table 11-1 of J-STD-001D. The inspection laboratory includes inspection and recording of known defects on through-hole and surface mount components. Successful completion of the module requires a minimum grade of 70 on a 25-question open book examination.

Who Should Attend?
Individuals who require understanding and interpretation of J-STD-001D process and acceptability criteria will benefit from this class. These include production operators, technicians, inspectors, auditors, quality personnel, manufacturing and engineering process engineers and management personnel.

What Do Attendees Receive?
Students who successfully complete this class receive an IPC J-STD-001D Certified Specialist certification which is valid for two (2) years. The certificate will indicate which module(s) the student has completed. A re-certification course must be completed prior to expiration of the Certified Specialist certificate.

Course Description
The IPC, nationally recognized as an electronics manufacturing trade association, has issued the IPC-A-610D "Acceptability of Electronic Assemblies." This document provides a pictorial interpretation of the board/board assembly showing target, acceptable and defect conditions. Used as the basis for training, the IPC-A-610D provides common, documented procedures and techniques for training and certifying specialists in application of the IPC-A-610D standard. This knowledge will enable the student to make valid accept/reject product decisions per the IPC-A-610D document.

This class is presented in modules which may be tailored to the needs of your organization. Class length is dependent upon the number of modules covered.  Review questions address main topics for each section. Open and closed-book examinations cover key elements in each module. Minimum passing average grade is 70%.

Course Outline

• Foreword
• Applicable Documents
• Handling Electronic Assemblies
• Hardware
• Soldering
• Terminal Connections
• Through-Hole Technology
• Surface Mount Assemblies
• Component Damage
• Printed Circuit Boards and Assemblies
• Discrete Wiring Acceptability Requirements
• High Voltage
• Written Examination/Review of Examinations

Who Should Attend?
Individuals who require understanding and interpretation of acceptability requirements will benefit from this class. These include solder operators, technicians, inspectors, auditors, quality personnel, manufacturing and engineering management personnel.

What Do Attendees Receive?
Students who achieve a combined score of 70 or higher will be awarded an IPC-A-610D Certified Specialist certification which is valid for two (2) years. A re-certification course must be completed prior to expiration of the Certified Specialist Certificate.

Course Description
The IPC, nationally recognized as an electronics manufacturing trade association, has issued the companion documents IPC-7711, Rework of Electronic Assemblies and IPC-7721, Repair and Modification of Printed Boards and Electronic Assemblies. Together, these documents provide a comprehensive data source for rework, repair, and modification of electronic assemblies.

Using these documents, the IPC has structured the IPC-7711/7721 Certified Specialist certification program, a multi-module hands-on solder training program addressing key topics in these documents. Consisting of nine (9) modules, the course may require from two (2) to nine (9) days for completion, depending upon skills and knowledge required by each student. IPC-7711 addresses Modules 1 through 6; IPC-7721 addresses Modules 7 through 9.

These modules may be combined to meet specific company/student needs. The student must successfully complete Module 1 before training on any other modules. Those modules may be addressed in any other sequence, allowing the student to improve his/her skills as required. Prior through-hole and surface mount soldering skills are required.

Upon successfully completing a module, the student will have demonstrated the skills necessary to meet the soldering/inspection requirements of that module.

Course Outline
Module 1 is 7.5 hours in length and includes lecture and a 20 question open book examination. Modules 2 through 9 vary in length between 5 hours and 7.5 hours as noted below. Each includes a short lecture, instructor demonstration, and a skills development lab. The student skills demonstration board is evaluated for each module by the instructor per IPC Class 3 workmanship criteria. A ten (10) question open book assessment is included for each module 2 through 9.

• Module 1. Documentation Introduction & Common Procedures -     Mandatory (8 hours)
• Module 2. Wire Splicing (5 hours)
• Module 3. Through-Hole Components (7.5 hours)
• Module 4. Chip and MELF Removal/Installation (6 hours)
• Module 5. SOIC and SOT Procedures (6 hours)
• Module 6. J-Lead and QFP Procedures (7.5 hours)
• Module 7. PWB Circuit Repair (7.5 hours)
• Module 8  Laminate Repair (5.5 hours)
• Module 9. Conformal Coating Identification, Removal and Replacement     (5 hours)

Who Should Attend?
Individuals who require understanding and enhancement of solder rework/repair techniques outlined in IPC-7711/7721 will benefit from this class. These include solder operators, production operators, technicians, inspectors, auditors, quality personnel, manufacturing and engineering management personnel.

What Do Attendees Receive?
The successful student will receive an IPC-7711/7721 Certified Specialist certification which is valid for two (2) years. The certificate will indicate which module(s) the student has completed. A re-certification course must be completed prior to expiration of the Certified Specialist certificate.