Scholarship

Feng, Xinzhi and Martin K. Anselm. "Case Study: Analyzing 0402 Capacitor Defects with Stencil Printing Misalignment when Using Water Soluble and No-Clean Solder Pastes." Proceedings of the SMTA International 2022. Ed. Richard Coyle. Minneapolis, MN: SMTA, 2022. Web.

Iturregui-Shelton, Sebastian , et al. "Stencil Cleaning Optimization for Fine-pitch Components." Proceedings of the SMTA International 2022. Ed. Richard Coyle. Minneapolis, MN: SMTA, 2022. Web.

He, Wenjing, Martin K. Anselm, and Richard Coyle. "Thermal Reliability of Mixing Bismuth-Containing Solder Paste with SAC BGAs At Low Reflow Temperatures - Part III." Proceedings of the SMTA International 2022. Ed. Raiyo Aspandiar. Minneapolis, MN: SMTA, 2022. Web.

Coyle, Richard, et al. "Thermal Cycling Performance of Hybrid Low Temperature Solder Joints Assembled at Different Peak Reflow Temperatures." Proceedings of the SMTA International 2022. Ed. Raiyo Aspandiar. Minneapolis, MN: SMTA, 2022. Web.

Coyle, Richard, et al. "Thermal Fatigue of Quad Flat No-Lead and Chip Resistor Solder Joints Assembled with SnPb, SAC305, and SnBi Solders." Proceedings of the SMTA International 2022. Ed. Raiyo Aspandiar. Minneapolis, MN: SMTA, 2022. Web.

Miller, Morgan, et al. "Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Defects." Proceedings of the SMTA International 2021. Ed. Richard Coyle. Minneapolis, MN: n.p., 2021. Web.

Kempaiah, Sahana Marur, et al. "Thermal Reliability of Mixing Bismuth-Containing Solder Paste with SAC BGAs at Low Reflow Temperatures - Part II." Proceedings of the SMTA International 2021. Ed. Richard Coyle. Minneopolis, MN: SMTA, 2021. Web.

Coyle, Richard, et al. "The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of Hybrid Low Temperature Solder Joints." Proceedings of the SMTA International 2021. Ed. Raiyo Aspandiar. Minneapolis, NY: SMTA, 2021. Web.

Fernandez, Raynier E. and Dr. Martin Karl Anselm. "Thermal Reliability of Mixing Bismuth-Containing Solder Paste with Sac Bgas at Low Reflow Temperatures – Part 1." Proceedings of the SMTAi 2020. Ed. Richard Coyle. Minneapolis, MN: SMTA, 2020. Web.

Borkes, Tom, Martin Anselm, and Malar Hirudayaraj. "Moving Beyond Paideia – Transforming our High Tech Educational Pipeline into one that Focuses on “Learning for Earning,” as well as “Learning for Learning”." Proceedings of the 2019 ASEE Mid-Atlantic Conference - Fall. Ed. Patti Greenawalt. New York City, New York: n.p., 2019. Web.

Swanson, Tayler J. and Martin Karl Anselm. "Properties of Mixing Sac Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process." Proceedings of the SMTAi 2019. Ed. Robert Rowland. Chicago, Illinois: SMTA, 2019. Web.

Kotain, Prithvi, Jeff Schake, and Martin Karl Anselm. "Robustness of High Tension, Standard Tension, and Mesh Mount Solder Paste Stencils." Proceedings of the SMTAi 2019. Ed. Robert Rowland. Chicago, Illinois: SMTA, 2019. Web.

Johnson, Charmaine, et al. "Attachment Quality and Thermal Fatigue Reliability of a Surface Mount Chip Resistor Assembled With a Low Temperature Solder." Proceedings of the SMTAi 2019. Ed. Robert Rowland. Chicago, Illinois: SMTA, 2019. Web.

Murling, Adam, et al. "Practical Implementation of Assembly Processes for Low-Melting Point Solder Pastes." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web.

Gomez, Priscilla, Tayler Swanson, and Martin K. Anselm. "A Study on The Minimum and Maximum Temperatures of The Reflow Process in SMT Assembly on Paste Containing Bismuth Alloys Combined with Lead-Free Solder Spheres." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web.

Bastardo, Keyla Y., Tayler Swanson, and Martin K. Anselm. "Experimental Study on The Capability And Performance of A Jet Dispensing Feeder in Components Fastening." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web.

Thomas, Shalomin, Keyla Y. Bastardo, and Martin K. Anselm. "Industry Trends in Photonics Packaging: Passive Fiber and Die Coupling." Proceedings of the Pan Pacific. Ed. Phil Isaacs. Kaui, Hawaii: SMTA, 2017. Web.

Valooran, Rohit and Martin K. Anselm. "Investigation of the Factors Influencing the Performance of Low Temperature Solder." Proceedings of the SMTAi 2017. Ed. Raiyo Aspandiar. Rosemont, IL: SMTA, 2017. Web.

Anselm, Martin K. and Reza Ghaffarian. "QFN Reliability, Thermal Shock, Lead-free vs. SnPb, Microstructure." Proceedings of the 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). Ed. Unknown. Orlando, FL: IEEE, 2017. Web.

Palaniappan, Sakthi Cibi Kannammal and Dr. Martin K. Anselm. "A STUDY ON PROCESS, STRENGTH AND MICROSTRUCTURE ANALYSIS OF LOW TEMPERATURE SnBi CONTAINING SOLDER PASTES MIXED WITH." Proceedings of the SMTAi September 2016. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web.

Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the Hybrid SMT. Ed. Hybrid SMT. Nurnberg, Barvaria, Germany: n.p., 2016. Web.

Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the SMTAi. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web.

Anselm, Martin Karl. "A.R.E.A. Component Warpage: Issues with Measurement and Standardization." Proceedings of the SMTA, September 29- October 2, Chicago IL. Ed. SMTA. Edina, MN 55424: n.p., 2014. Web.

Anselm, Martin K. "Seeking University Graduate Talent and Collaborators for Industrial Research." SMTAi. SMTA. Chicago, Illinois. 22 Sep. 2019. Conference Presentation.

Anselm, Martin K. "WIT at RIT” - Women in Technology & Is Photonics Integration in our Future?" SMTAi. SMTA. Chicago, IL. 15 Oct. 2018. Conference Presentation.

Anselm, Martin K. "Integrated Photonics Packaging Reliability — Assessing Packaging Strategies and Reliability Testing." International Integrated Reliability Workshop. IEEE. Fallen Leaf Lake, CA. 8 Oct. 2017. Conference Presentation.

Yeritsyan, Hrant, ed. Journal of Electronic Materials. New York: Springer, 2018. Web.

Ramkumar, Dr. Manian, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print.

Pan, Jianbiao, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print.

Park, Seungbae, ed. ASME Journal of Electronic Packaging. New York: ASME, 2017. Web.

Arfaei, Dr. Babak, ed. JOM Special Issue. USA: n.p., 2016. Print.

Byko, Maureen, ed. The Journal of The Minerals, Metals & Materials Society (TMS). Warrendale, PA: he Minerals, Metals & Materials Society, 2015. Print.

Su, Quang T., et al. "Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking." ASME Journal of Electronic Packaging 140. 041004-1 (2018): 9. Web.

Sriperumbudur, Sai Srinivas, Dr. Martin K. Anselm, and Michael Meilunas. "Solder Paste Volume Effects on Assembly Yield and Reliability for Bottom Terminated Components." Soldering & Surface Mount Technology. (2016): 1-16. Print.