Martin K. Anselm Headshot

Martin K. Anselm

Associate Professor

Department of Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
mkamet@rit.edu
585-475-2005
Office Location
SLA-1518

Martin K. Anselm

Associate Professor

Department of Manufacturing and Mechanical Engineering Technology
College of Engineering Technology

Education

BS, State University College at Geneseo; MS, Clarkson University; Ph.D., Binghamton University

Bio

Dr. Martin K. Anselm (Director of the Center for Electronics Manufacturing, RIT).  Dr. Anselm holds an undergraduate degree in Physics, a Masters in Mechanical Engineering and a Ph.D. in Materials Science & Engineering.  Dr. Anselm's Industrial experience includes twelve years of electronics failure analysis and root cause analysis. He also managed the Universal Instruments AREA Consortium which conducted research in assembly materials, process and reliability of electronic packaging. Dr. Anselm served on the Board of Directors for the Surface Mount Technology Association (SMTA) from 2013-2019.

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mkamet@rit.edu
585-475-2005
Personal Links
LinkedIn

Select Scholarship

Journal Paper
Anselm, Martin K., Nithin Lakshminarayan, and Michael Meilunas. "Vibration Analysis of Low Temperature BGA And LGA Solder Joints at Elevated Test Temperatures." Microelectronics Reliability 165. (2025): 1-19. Web.
Swanson, Tayler J. and Martin K. Anselm. "Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process." Journal of SMTA 36. 3 (2023): 25-34. Web.
Su, Quang T., et al. "Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking." ASME Journal of Electronic Packaging 140. 041004-1 (2018): 9. Web.
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Published Conference Proceedings
Klett, Adam and Martin K. Anselm. "UNLOCKING ACADEMIC-INDUSTRY SYNERGY: A COLLABORATIVE MODEL FOR HANDS-ON ELECTRONICS MANUFACTURING EDUCATION." Proceedings of the Pan Pacific Strategic Electronics Symposium. Ed. Mike Konrad. Minniapolis, MN: SMTA, 2025. Web.
Moreau, Miles, et al. "Thermocouple Tactics: A Comparative Study of Attachment Methods." Proceedings of the SMTAI. Ed. Raiyo Aspandiar. Chicago, IL: SMTA, 2024. Web.
Coyle, Richard, et al. "The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-free Solder Alloys." Proceedings of the SMTAI. Ed. Raiyo Aspandiar. Chicago, IL: SMTA, 2024. Web.
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Peer Reviewed/Juried Poster Presentation or Conference Paper
Coyle, Richard and Martin K. Anselm. "The Effect of Extended Dwell Time on Thermal Cycling Performance of Hybrid Low Temperature Solder Joints." Proceedings of the ECTC. Ed. Patrick Thompson. Elizabethtown, KY: IEEE.
Coyle, Richard, et al. "The Thermal Cycling Performance of Hybrid Low Temperature Solder Joints Tested at a High Homologous Temperature." Proceedings of the SMTAI. Ed. Raiyo Aspandiar. Minniapolis, MN: SMTA.
Slater, Zachary and Martin K. Anselm. "Case Study: Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment When Using Water Soluble And No-Clean Solder Pastes: Part 2." Proceedings of the SMTAI. Ed. Raiyo Aspandiar. Minniapolis, MN: SMTA.
Invited Keynote/Presentation
Anselm, Martin K. "Seeking University Graduate Talent and Collaborators for Industrial Research." SMTAi. SMTA. Chicago, Illinois. 22 Sep. 2019. Conference Presentation.
Anselm, Martin K. "WIT at RIT” - Women in Technology & Is Photonics Integration in our Future?" SMTAi. SMTA. Chicago, IL. 15 Oct. 2018. Conference Presentation.
Anselm, Martin K. "Integrated Photonics Packaging Reliability — Assessing Packaging Strategies and Reliability Testing." International Integrated Reliability Workshop. IEEE. Fallen Leaf Lake, CA. 8 Oct. 2017. Conference Presentation.
Journal Editor
Yeritsyan, Hrant, ed. Journal of Electronic Materials. New York: Springer, 2018. Web.
Ramkumar, Dr. Manian, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print.
Pan, Jianbiao, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print.
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Currently Teaching

MCET-101
Fundamentals of Engineering
3 Credits
Students will apply engineering problem solving methods used in industry to complete projects involving engineering topics such as mechanics, circuits, robotics, and thermodynamics. Software tools are used to model their designs, perform design calculations, collect and analyze data. Finally, students will present their work professionally using both written and oral communication software. The goal of the class is to have students become familiar with the many aspects of mechanical engineering through hands on, experiential learning and prepares them to work professionally and effectively in a team setting both in college and in industry.
MCET-111
Characterization of Metals Lab
1 Credits
This lab class accompanies MCET-110 Foundations of Materials. An emphasis is placed on determining material, primarily metals, properties though experimentation and references, and analyzing why a particular material was selected for an application based on the materials properties. Differentiation of materials families is made based on properties. A variety of discovery activities are used to explore the world of metals, including labs of various types, materials selection software, and internet resources.
RMET-545
Electronics Manufacturing
3 Credits
This course provides a thorough understanding of the technology, components, equipment, materials and manufacturing process for through hole technology and surface mount technology electronics manufacturing. Students will develop a strong foundation needed for advanced work in surface mount technology (SMT). Topics in Design for Manufacturing are also considered for high volume vs. low volume manufacturing. Students may only receive credit for this course or RMET-645, not both.
RMET-556
Advanced Concepts in Semiconductor Packaging
3 Credits
The advanced course in semiconductor packaging will provide a thorough coverage of the materials, processes, failure, and reliability of chip level packaging. Specific topics include single-chip, multi-chip, wafer level and 3D stacked packaging, photonic integrated chip (PIC), smaller passives and embedded passive component technology, advanced substrates and microvia technology, solder technologies, metallurgy and joint formation, thermal management, thermal and mechanical behavior of packaging, failure analysis, and reliability testing. This course is cross-listed with RMET-656; students may receive credit for RMET-556 or RMET-656, not both.
RMET-645
Surface Mount Electronics Manufacturing
3 Credits
This course provides a thorough understanding of the technology, components, equipment, materials and manufacturing process for through hole technology and surface mount technology electronics manufacturing. Students will develop a strong foundation needed for advanced work in surface mount technology (SMT). The activities will provide the students an orientation and familiarization of the manufacturing equipment and process parameters for printed circuit board assembly. Graduate students will explore surface defects and remediation and will prepare a detailed annotated bibliography related to specific aspects of electronics manufacturing. Topics in Design for Manufacturing are also considered for high volume vs. low volume manufacturing. Students may only receive credit for this course or RMET-545, not both.
RMET-656
Advanced Concepts in Semiconductor Packaging
3 Credits
The advanced course in semiconductor packaging will provide a thorough coverage of the materials, processes, failure, and reliability of chip level packaging. Specific topics include single-chip, multi-chip, wafer level and 3D stacked packaging, photonic integrated chip (PIC), smaller passives and embedded passive component technology, advanced substrates and microvia technology, solder technologies, metallurgy and joint formation, thermal management, thermal and mechanical behavior of packaging, failure analysis, and reliability testing. Course includes projects and literature review in topics of semiconductor packaging. This course is cross listed with RMET-556 students may receive credit for RMET-556 or RMET-656, not both.
RMET-788
MMSI Thesis Planning
3 Credits
Students will rigorously develop their thesis research ideas, conduct literature reviews, identify and plan methodologies, prepare schedules, and gain a clear understanding of the expectations of the faculty and the discipline. Each student will be required to prepare a committee approved thesis research proposal and may begin work on their thesis.
RMET-790
MMSI Thesis
3 Credits
The MMSI thesis is based on thorough literature review and experimental substantiation of a problem, by the candidate, in an appropriate topic. A written proposal has to be defended and authorized by the faculty adviser/committee. The proposal defense is followed by experimental work, a formal written thesis, and oral presentation of findings. The candidate should have completed the requisite courses for the program before enrolling for the thesis.
RMET-797
MMSI Capstone Project
3 Credits
This course provides the MMSI graduate students an opportunity to complete their degree requirements by addressing a practical real-world challenge using the knowledge and skills acquired throughout their studies. This course is not only the culmination of a student's course work but also an indicator of the student's ability to use diverse knowledge to provide a tangible solution to a problem. The capstone project topic can be in the areas of product development, manufacturing automation, management system, quality management or electronics packaging. The course requires a comprehensive project report and a final presentation.
RMET-798
Continuation of Capstone
0 Credits
Continuation of Capstone

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